"Dual-Expo Surprise" in Chongqing | Unveiling the Breakthrough Clash of Semiconductor Cutting-Edge Tech and Industrial Intelligence

In April's sizzling Chongqing, where hotpot bubbles with fervor, BAKON's "tech hotpot" simmered even hotter! The GEME Semiconductor Expo and EIM Industrial Intelligence Expo concluded with a dual triumph, and we're serving you a hardcore recap covered in "sparkling solder joints" and "data-stained hands."

【GEME Semiconductor Expo • Desoldering Station Steals the Spotlight】
While others showcase chips, we shield the "heart of chips"!
The BK8586MX + 852MX duo unleashed three core technologies safeguarding semiconductor integrity:

1. Millimeter-Precision Surgical Tool – BK8586MX Hot Air Desoldering System
   Equipped with infrared positioning, it achieves seamless "hot air blade-cold air shield" switching within 0.5mm. Test data reveals temperature fluctuations within ±1℃ during solder joint removal—steadier than a simmering hotpot bubble!

2. 3-Stage Thermal Control Matrix – 852MX Intelligent Temperature Control System
   Its proprietary "stepped temperature control method" enables extreme jumps from 200℃ to -5℃ in 0.01 seconds. The thermal curve mirrors an ECG's precision, melting solder joints while instantly erecting a "thermal cocoon" for wafers.

3. Lightning-Speed Rework Counterattack – Dual-Mode Synergy
   The BK8586MX and 852MX systems collaborate to execute a revolutionary "reverse soldering method," reconstructing micron-level solder joints in 0.05 seconds. Live expo demos showed zero residual solder balls (0.02mm) in QFN package disassembly and BGA rework temperature deviations under 0.5℃—protecting chips before flux oxidation even occurs!

   
   

【EIM Industrial Expo • A Sneak Peek into Future Factories】
At EIM, BAKON targeted semiconductor pain points with the U582/583/362/362S Smart ESD Prevention Systems. Designed for precision manufacturing, these systems break through with three core technologies:

1. Micron-Level Protection Accuracy
   Multi-stage intelligent field regulation creates dynamic electrostatic shielding within 0.02mm solder zones, with response times slashed to 0.01 seconds—dramatically reducing ESD risks to delicate components.

2. Environmental Adaptability Breakthrough
   Modular design enables seamless integration into existing lines, meeting Class 10 cleanroom standards for semiconductor packaging and ultra-precision electronics assembly.

3. Intelligent Adaptive Tuning
   Sensors monitor electrostatic field changes in real-time, coordinating ion blowers and grounding devices to stabilize electrostatic voltage within ±50V while auto-optimizing protection parameters to production rhythms. This solves micro-component ESD control challenges and offers fresh ideas for factory upgrades.

   
   

【Highlight • Industry Collaboration】
BAKON's booth hosted a special delegation—the Chongqing Indoor Environment Purification Industry Association!
A 30-member expert team deeply explored BAKON's smart manufacturing solutions, from cleanroom tech to ESD systems, sparking discussions on "converging clean production with intelligent manufacturing." The association president praised: "BAKON's meticulous innovation sets a new industry benchmark!" Both parties now plan a "Joint Clean Manufacturing Lab" to tackle high-precision production challenges.

【Tech Voice • Industry Stage】
BAKON Technical Manager Li Xueqing stole the show at the STE Electronic Smart Manufacturing International Forum with her speech "Breaking ESD Barriers in Smart Manufacturing". "ESD protection isn't a cost—it's Intelligent Manufacturing's 'invisible fuse!'" she declared, unveiling the UNESD-patented "Universal Electrostatic Management System" that slashed ESD interference by 90%. The audience erupted: "Game-changing!" Post-speech, multiple Southwest enterprises sought technical details and partnerships.

【BAKON Tools • Crafting the Future】
Over 2,000 visitors flooded BAKON's booth, with 30+ enterprises extending collaboration offers across semiconductor packaging and smart factories. The expo may have ended, but BAKON's "smart manufacturing revolution" never stops! To every partner who "soldered" with us in Chongqing—your support fuels our drive.

Next up:
BAKON invites you to Turkey
for the annual Istanbul International Industrial Fair.
We’ll be there, will you?